• Exhibition:
  • Booth No: 11-1

Adhensive bonding at 3000 deg.C

Adhensive bonding at 3000 deg.C
Adhensive bonding at 3000 deg.C


  1. New Product
  2. Feature Adhensive technology for High Temp. Complex shape, Composite bonding
  3. Country of Manufacturer: Japan
  4. Product Categories:
    Ceramics Related
    • Ceramics/Raw Material
    • Ceramics Product/Processing
    • Related Technology
    Adhesion/Joining Related
    • Joining Equipment
    • Coating Equipment/Surface Treatment
    • Related Technology

*Contact information is open to public for the purpose of visitors to request appointments before the show.
Unauthorised sales activities a/o inappropriate activities toward exhibitors are strictly prohibited.

Visitor Ticket Request (FREE)

10th Highly-functional Material Week TOKYO 29th FINTECH JAPAN 19th Photonix 2019

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