AJINOMOTO FINE-TECHNO CO., INC.

  • Exhibition:
    3rd ADHESION & JOINING EXPO TOKYO
  • Booth No: 11-50

One component low temperature thermoset adhesive / encapsulation

One component low temperature thermoset adhesive / encapsulation
One component low temperature thermoset adhesive / encapsulation

詳細

  1. New Product
  2. Feature Unique low temperature curing
  3. We have low temperature unique technology as core technology.We create new value by giving various functions based on core technologies. (Flexyble, Impregnation, electric conductive, UV temporaly fixing etc.)

  4. Product Categories:
    Adhesion/Joining Related
    • Adhesive Agent/Tape
    LCD/OLED Related
    • Material/Component

*Contact information is open to public for the purpose of visitors to request appointments before the show.
Unauthorised sales activities a/o inappropriate activities toward exhibitors are strictly prohibited.

Visitor Ticket Request (FREE)

10th Highly-functional Material Week TOKYO 29th FINTECH JAPAN 19th Photonix 2019

For Visiting Enquiries

Contact us by e-mail +81-3-3349-8568

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